WELEXON's Leading-Edge Capabilities Deliver Reliable Advanced Technology Solutions

We are recognized as an industry-leading provider of advanced technology PCB product solutions across the telecommunications & networking market. Our key telecommunications manufacturing facilities are TL9000 certified and provide our customers with the highest levels of technology and quality.

WELEXON has expertise in RF and specialty components, engineered thermal solutions, and advanced photonics packaging that set us apart from other PCB manufacturers. Our value goes beyond PCB and offers an integrated, complete solution to support your full product lifecycle.

WELEXON has a number of solutions and broad expertise for Networking and Telecommunications applications

CONVENTIONAL PCBS

Conventional PCBs can be any layer count but rely on conventional drilling and plating technology. Find out more about our Conventional PCB offerings.

RF / MICROWAVE PCBS

All cellular devices require a network of base stations to function. The base station antennas transmit and receive RF signals, or radio waves, to and from mobile phones near the base station.

HIGH-DENSITY INTERCONNECT (HDI) PCBS

HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products.

RF AND SPECIALTY COMPONENTS

WELEXON manufactures a range of passive components used extensively in cellular base stations and tower mounted hardware. These products are critical signal path products that allow our customers the highest levels of performance while keeping costs down. We also offer expertise in advanced photonics packaging, engineered thermal solutions, and integrated RF solutions. Our teams have deep expertise in this area and we continue to offer differentiated products that support our innovative customer-base.

General Networking & Communications Capabilities

HIGH LAYER-COUNT

LASER MICROVIAS

ADVANCED MATERIALS

HIGH-VOLUME 2.0 CORE MATERIAL

HYBRID & SEQUENTIAL STRUCTURES

THERMAL MANAGEMENT SOLUTIONS

OVERSIZED LINE CARD AND BACKPLANED

ADVANCED AND CONVENTIONAL HIGH-DENSITY INTERCONNECT (HDI) PCBS

WELEXON Continually Invests in Capital and Talent to Meet the Needs of Networking & Communications Industries

WELEXON CHIPPEWA FALLS (CF)

WELEXON Chippewa Falls (CF) is a leader in advanced high technology PCBs for use in volume applications.

  • High layer count
  • Laser microvias
  • Advanced materials
  • High volume 2.0 core material

WELEXON DONGGUAN (DMC)

WELEXON Dongguan (DMC) was established in 2001 and is best suited for advanced technology multi-layer PCB in volume.

  • High layer count
  • Conventional
  • Hybrid & sequential structure
  • HDI

WELEXON GUANGZHOU (GZ)

WELEXON Guangzhou (GZ) is best suited for advanced technology multi-layer PCB in volume application.

  • High layer count
  • Conventional and advanced HDI
  • Oversized line card and backplanes
  • Hybrid & sequential structures
  • Thermal management
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Have Questions? We Have Answers.

Our key telecommunications manufacturing facilities are TL9000 certified and provide our customers with the highest levels of technology and quality.

Contact us today to get started with a complete solution supplier.

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