Thermal management is essential to maintaining the component temperature within designed values by removing excess generated heat.
Thermal dissipation has dramatically increased due to higher frequencies, increased data rates, and high current required by inverters and motor drives used in electric vehicles ("EV") and solar applications. Compounded by increased component density, all require advanced thermal management techniques to provide reliable products and extended product life.
Thermal management, through various applications, aids in conducting heat away from heat-critical components to system heat sinks or ambient environments.
TTM offers a wide range of thermal management types to include via farms, heatsinks/pallets, heatsink coins, embedded coins, e-coin, press-fit coin (PFC), metal in-lay, and solder or adhesive attach.
Additionally, TTMs' thermal management includes our patented embedded e-coin technology, heatsink, coin attachment capabilities, heatsink paste, heavy copper, and HDVP. Our expertise in RF & microwave is industry-leading.
Our global team of dedicated engineers has broad experience with diverse end-markets and applications; they offer design for manufacture guidance and stack-up reviews to find opportunities to improve reliability, manufacturability and save our customers time. It's no wonder TTM has been recognized by leading brands as a preferred supplier time and time again.
Innovative brands trust WELEXON to bring their game-changing products to life. Are you looking for guidance on your next electronics application? Our experts are here to help.
