RF and Microwave PCB

Innovative Engineering and Advanced Process Capabilities

From defense, space, and aerospace electronics, to medical devices, imaging, complex telecommunications equipment, to 5G enablement, and mmWave automotive radar, WELEXON supports a wide range of frequency bands (L, S, C, X, Ku, K, Ka, V, W). We have extensive experience with a wide range of low-loss laminate materials and a total of over 70 resin systems.

We are investing in research and development to provide our customers with data regarding signal integrity, materials, and high-reliability design for manufacture guidance to ensure our customers RF/Microwave reliant applications meet the needs of the market and stringent standards for quality and performance required for specific industries and reliability in the field. WELEXON has a dedicated Signal Integrity Lab and continues to provide industry-leading research and development in collaboration with the customers we serve.

Our broad product offerings and one-stop capabilities provide our customers with complete product lifecycle support; we have a range of engineered thermal solutions, high-current testing capabilities, low-temperature cofired ceramics (LTCC) solutions, microwave attenuators, and so much more to ensure we add value at each stage of the product's journey from NPI to end-of-life. Our rigorous testing and adherence to internationally recognized quality and environmental standards are just a few reasons why WELEXON's teams are recognized as exceptional and why leading brands worldwide trust our advanced technology solutions.

Discover Our Family of Microvia Technologies

TIGHT PROCESS TOLERANCES FOR CRITICAL RF FEATURES

+/- 0.0005" (12.7um) standard tolerance on etched features for un-plated 0.5oz copper
Selective plated up layers allowing +/- 0.0005" (12.7um) etch tolerances
Exact registration / laser direct imaging
Front to back registration of etched cores to +/-0.001" (25.4um)
Hybrid dielectric material constructions
Buried via / blind via / microvia
Ormet paste for z-axis interconnects
Multi-level cavity constructions
Optical milling / drilling
Laser routing / machining
Sequential lamination
Polytetrafluoroethylene ("PTFE") Fusion Bond
Formed PCBs
Plated edges and slots

BACKDRILL FOR PRECISION STUB REMOVAL

Mechanical back-drilling (minimal stub)
Laser drilling (no stub)
Laser modified controlled depth drill (mechanical drill followed by laser clean-up, no stub)
Multi-functional hole technology allowing two nets in one hole location

HOLE FILL OPTIONS

Via-In-Pad-Plated-Over (VIPPO) with conductive and non-conductive epoxy
Solid copper plated microvia and small mechanical drilled plated through vias
Partial hole-fill options

THERMAL SOLUTIONS

Copper coins and slugs
HDVP & ThermalVia®
Metal core, metal backed, and IMS
Thermally conductive laminates
Heatsink assembly department to laminate heatsink or interface plates to the circuit boards

EMBEDDED CAPABILITIES

Planar Resistors / Capacitors
- Ohmega and ticer
- Screened ink resistors
- Planar capacitance materials: laminate, film based and High dielectric constant ("Dk") filled
Circulators
- On-board circuit
- Embedded ferrites
Embedded passive components

RFACE FNISHES

Electroless Nickel, Immersion Gold ("ENIG") standard solder assemblies
Electroless Nickel, Electroless Palladium, Immersion Gold ("ENEPIG")
Electroless Palladium, Immersion Gold ("EPIG")
Hard and soft wire-bondable gold
Immersion silver
OSP

RF ASSEMBLY, PERFORMANCE TESTING, AND ANALYSIS

RF assembly of connector, surface mount component, drop-in cavity components, hand, and automated solder assembly options
RF test centers have extensive engineering and test capabilities, including multiple Network Analyzers with combined frequency sweep coverage up to 110 GHz.
RF and Microwave dielectric material test and characterization capabilities
3D laser scanning for copper foil profile analysis
2D Static field solvers as well as 3D full-wave simulation capability
Custom anechoic boxes for antenna measurements
Switch matrix capability for multiple measurements between human interaction